PERTANIKA JOURNAL OF SCIENCE AND TECHNOLOGY

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• Abtew, M., & Selvaduray, G. (2000). Lead-free solders in microelectronics. Materials Science and Engineering, 27, 95–141.
  
  Ahmed, S., Basit, M., Suhling, J. C., & Lall, P. (2016). Effects of aging on SAC-Bi solder materials. In 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 746-754). IEEE Publishing. https://doi.org/10.1109/ITHERM.2016.7517621
  
  Akkara, F. J., Hamasha, S., Alahmer, A., Evans, J., Belhadi, M. E. A., & Wei, X. (2022). The effect of micro-alloying and surface finishes on the thermal cycling reliability of doped SAC solder alloys. Materials, 15(19), Article 6759. https://doi.org/10.3390/ma15196759
  
  Al Athamneh, R., & Hamasha, S. (2020). Fatigue behavior of SAC-Bi and SAC305 solder joints with aging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(4), 611–620. https://doi.org/10.1109/TCPMT.2019.2949719
  
  Ali, H. E., El-Taher, A. M., & Algarni, H. (2024). Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder. Materials Today Communications, 39, Article 109113. https://doi.org/10.1016/j.mtcomm.2024.109113
  
  Ali, U., Khan, H., Aamir, M., Giasin, K., Habib, N., & Owais Awan, M. (2021). Analysis of microstructure and mechanical properties of bismuth-doped SAC305 lead-free solder alloy at high temperature. Metals, 11(7), Article 1077. https://doi.org/10.3390/met11071077
  
  Arfaei, B., Mutuku, F., Coyle, R., Cotts, E., & Wilcox, J. (2015, May). Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology. In 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (pp. 118-126). IEEE Publishing. https://doi.org/10.1109/ECTC.2015.7159580
  
  Belhadi, M. E. A., Wei, X., Qasaimeh, Q., Vyas, P., Zhao, R., Hmasha, E., Ali, D., Suhling, J., Hamasha, S., Lall, P., Ali, H., & Prorok, B. C. (2022). Indentation creep properties evolution of lead-free solder joints subjected to thermal cycling. In 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (pp. 1-8). IEEE Publishing. https://doi.org/10.1109/iTherm54085.2022.9899582
  
  Belhadi, M. E. A., Wei, X., Vyas, P., Zhao, R., Hamasha, S., Ali, H., Suhling, J., Lall, P., & Prorok, B. C. (2022). Reliability and IMC layer evolution of homogenous lead-free solder joints during thermal cycling. In IPC APEX 2022 Technical Conference Proceedings (pp. 1–14). ResearchGate. https://www.researchgate.net/publication/364722213
  
  Belhadi, M. E. A., Wentlent, L., Al Athamneh, R., & Hamasha, S. (2019). Mechanical properties of SAC-Bi solder alloys with aging. In Proceedings of SMTA International (pp. 431–438). ResearchGate. https://www.researchgate.net/publication/337439000
  
  Bhavan, J. S., Pazhani, A., Amer, M., Patel, N., & Unnikrishnan, T. G. (2024). Microstructural evolution and phase transformation on Sn–Ag solder alloys under high-temperature conditions focusing on Ag3Sn phase. Advanced Engineering Materials, 26(13), Article 2400660. https://doi.org/10.1002/adem.202400660
  
  Borgesen, P., Wentlent, L., Alghoul, T., Sivasubramony, R., Yadav, M., Thekkut, S., Cuevas, J. L. T., & Greene, C. (2019). A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes. Microelectronics Reliability, 95, 65–73. https://doi.org/10.1016/j.microrel.2019.02.001
  
  Cai, C., Xu, J., Wang, H., & Park, S. B. (2021). A comparative study of thermal fatigue life of eutectic Sn-Bi, hybrid Sn-Bi/SAC and SAC solder alloy BGAs. Microelectronics Reliability, 119, Article 114065. https://doi.org/10.1016/j.microrel.2021.114065
  
  Coyle, R. J., Sweatman, K., & Arfaei, B. (2015). Thermal fatigue evaluation of Pb-free solder joints: Results, lessons learned, and future trends. JOM, 67(10), 2394–2415. https://doi.org/10.1007/s11837-015-1595-1 Darwish, S. M., Al-Habdan, S., & Al-Tamimi, A. (2000). A knowledge-base for electronics soldering. Journal of Materials Processing Technology, 97(1–3), 1–9.
  
  Dele-Afolabi, T. T., Hanim, M. A. A., Ojo-Kupoluyi, O. J., & Calin, R. (2019). Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate. Journal of Alloys and Compounds, 808, Article 151714. https://doi.org/10.1016/j.jallcom.2019.151714
  
  Dele-Afolabi, T. T., Hanim, M. A. A., Calin, R., & Ilyas, R. A. (2020). Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions. Microelectronics Reliability, 110, Article 113681. https://doi.org/10.1016/j.microrel.2020.113681
  
  Delhaise, A. M., Snugovsky, P., Kennedy, J., Hillman, D., Matijevic, I., Meschter, S., Adams, D., Kammer, M., Romansky, M., Juarez, J., Straznicky, I., Snugovsky, L., Wilcoxon, R., & Perovic, D. D. (2020). Thermal preconditioning and restoration of bismuth-containing, lead-free solder alloys. Journal of Electronic Materials, 49(1), 116–127. https://doi.org/10.1007/s11664-019-07666-w
  
  Depiver, J. A., Mallik, S., & Harmanto, D. (2021). Solder joint failures under thermo-mechanical loading conditions - A review. In Advances in Materials and Processing Technologies (Vol. 7, Issue 1, pp. 1–26). Taylor and Francis Ltd. https://doi.org/10.1080/2374068X.2020.1751514
  
  El-Daly, A. A., El-Taher, A. M., & Gouda, S. (2015). Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Materials and Design, 65, 796–805. https://doi.org/10.1016/j.matdes.2014.10.006
  
  Gao, Y., Bian, X., Qiu, X., Jia, Y., Yi, J., & Wang, G. (2023). Investigation of microstructure and mechanical properties of SAC105 solders with Sb, In, Ni, and Bi additions. Materials, 16(11), Article 4059. https://doi.org/10.3390/ma16114059
  
  Graver C. C. C., Yu, C. K., Tina, S., Cherie, C., & Jeffrey, L. (2009). The correlation investigation between cyclic bending and thermal cycling testing in CSP package on board. In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (pp. 510-513). IEEE Publishing. https://doi.org/10.1109/IMPACT.2009.5382231
  
  Haq, M. A., Hoque, M. A., Suhling, J. C., & Lall, P. (2022). Mechanical behavior and microstructure evolution in SAC+Bi lead free solders subjected to mechanical cycling. In 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (pp. 1-8). IEEE Publishing. https://doi.org/10.1109/iTherm54085.2022.9899538
  
  Hasan, S. K., Fahim, A., Suhling, J. C., & Lall, P. (2020). Mechanical behavior evolution of SAC+ Bi lead free solder exposed to thermal cycling. In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1180-1190). IEEE Publishing. https://doi.org/10.1109/ITherm45881.2020.9190579
  
  Hodúlová, E., Li, H., Šimeková, B., & Kovaříková, I. (2018). Structural analysis of SAC solder with Bi addition. Welding in the World, 62(6), 1311–1322. https://doi.org/10.1007/s40194-018-0629-z
  
  Hokka, J., Mattila, T. T., Xu, H., & Paulasto-Kröckel, M. (2013). Thermal cycling reliability of Sn-Ag-Cu solder interconnections - PART 2: Failure mechanisms. Journal of Electronic Materials, 42(6), 963–972. https://doi.org/10.1007/s11664-013-2475-5
  
  Hoque, M. A., Haq, M. A., Suhling, J. C., & Lall, P. (2021). Mechanical behavior and microstructure evolution in lead free solders subjected to mechanical cycling at elevated temperatures. In 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (pp. 2340-2347). IEEE Publishing. https://doi.org/10.1109/ECTC32696.2021.00366
  
  Jeon, C., Choi, Y., Jeong, H., Seo, K., Rhew, K., Bae, J., & Hwang, Y. (2023). Investigation of acceleration factors for SnAgCu-Bi solder Joints under various temperature cycling test conditions. In 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (pp. 846-851). IEEE Publishing. https://doi.org/10.1109/ECTC51909.2023.00146
  
  Jian, M., Hamasha, S., Alahmer, A., Hamasha, M., Wei, X., Belhadi, M. E. A., & Hamasha, K. (2023). Analysis and modeling of aged SAC-Bi solder joints subjected to varying stress cycling conditions. Materials, 16(2), Article 0750. https://doi.org/10.3390/ma16020750
  
  Jian, M., Hamasha, S., Alahmer, A., Wei, X., Belhadi, M. E. A., Alakayleh, A., & Tahat, S. (2023). Shear fatigue analysis of SAC-Bi solder joint exposed to varying stress cycling conditions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(2), 274–283. https://doi.org/10.1109/TCPMT.2023.3240367
  
  Kaimkuriya, A., Sethuraman, B., & Gupta, M. (2024). Effect of physical parameters on fatigue life of materials and alloys: A critical review. Technologies, 12(7), Article 100. https://doi.org/10.3390/technologies12070100
  
  Kanchanomai, C., Miyashita, Y., & Mutoh, Y. (2002). Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders. Journal of Electronic Materials, 31, 456–465.
  
  Kanlayasiri, K., & Sukpimai, K. (2016). Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate. Journal of Alloys and Compounds, 668, 169–175. https://doi.org/10.1016/j.jallcom.2016.01.231
  
  Li, G. Y., & Shi, X. Q. (2006). Science press effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints. Transactions of Nonferrous Metals Society of China, 16, s739-s743. https://doi.org/10.1016/S1003-6326(06)60292-6
  
  Li, M. L., Zhang, L., Jiang, N., Zhang, L., & Zhong, S. J. (2021). Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review. Materials & Design, 197, Article 109224. https://doi.org/10.1016/j.matdes.2020.109224
  
  Libot, J. B., Alexis, J., Dalverny, O., Arnaud, L., Milesi, P., & Dulondel, F. (2018). Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. Microelectronics Reliability, 83, 64–76. https://doi.org/10.1016/j.microrel.2018.02.009
  
  Liu, V., Zou, Y. S., Chen, Y. Y., Chang, W. L., Foo, X. Q., Chen, Y. J., Chen, C. M., Chung, M. H., & Gan, C. L. (2024). Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application. Materials Science in Semiconductor Processing, 179, Article 108489. https://doi.org/10.1016/j.mssp.2024.108489
  
  Mahdavifard, M. H., Sabri, M. F. M., Shnawah, D. A., Said, S. M., Badruddin, I. A., & Rozali, S. (2015). The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy. Microelectronics Reliability, 55(9–10), 1886–1890. https://doi.org/10.1016/j.microrel.2015.06.134
  
  Maruf, M. A., Mazumder, G. R., Chakraborty, S., Suhling, J. C., & Lall, P. (2024). Effects of combined isothermal aging and mechanical cycling exposures on the mechanical behavior of lead-free solder alloys. In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-8). IEEE Publishing. https://doi.org/10.1109/ITherm55375.2024.10709399
  
  Miao, Y., Dong, T., Li, C., Yang, J., Lu, Q., Xu, Z., Zhang, X., Peng, J., & Yi, J. (2024). Effects of Sb on the properties and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints. Journal of Materials Research and Technology, 30, 9494–9502. https://doi.org/10.1016/j.jmrt.2024.06.023
  
  Ramli, M. I. I., Salleh, M. A. A. M., Abdullah, M. M. A. B., Zaimi, N. S. M., Sandu, A. V., Vizureanu, P., Rylski, A., & Amli, S. F. M. (2022). Formation and growth of intermetallic compounds in lead-free solder joints: A review. Materials, 15(4), Article 1451. https://doi.org/10.3390/ma15041451
  
  Ren X. L., Wang, Y. P., Lai, Y. Q., Shi, S. Y., Liu, X. Y., Zou, L. J., & Zhao, N. (2023). Effects of in addition on microstructure and properties of SAC305 solder. Transactions of Nonferrous Metals Society of China (English Edition), 33(11), 3427–3438. https://doi.org/10.1016/S1003-6326(23)66344-7
  
  Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H., & Islam, M. N. (2006). Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407(1–2), 208–214. https://doi.org/10.1016/j.jallcom.2005.06.050
  
  Romdhane, E. B., Roumanille, P., Guedon-Gracia, A., Pin, S., Nguyen, P., & Fremont, H. (2022). QFN (Quad Flat No-lead) SAC solder joints under thermal cycling: Identification of two failure mechanisms. In 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (pp. 716-722). IEEE Publishing. https://doi.org/10.1109/ECTC51906.2022.00120
  
  Shen, Y. A., Zhou, S., Li, J., Yang, C. H., Huang, S., Lin, S. K., & Nishikawa, H. (2019). Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology. Materials and Design, 183, Article 108144. https://doi.org/10.1016/j.matdes.2019.108144
  
  Sivakumar, P., O’Donnell, K., & Cho, J. (2021). Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders. Materials Today Communications, 26, Article 101787. https://doi.org/10.1016/j.mtcomm.2020.101787
  
  Su, S., Jian, M., & Hamasha, S. (2020). Effects of surface finish on the shear fatigue of SAC-based solder alloys. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(3), 457–466. https://doi.org/10.1109/TCPMT.2019.2942806
  
  Swanson, T. J., & Anselm, M. K. (2023). Properties of mixing SAC solder alloys with bismuth-containing solder alloys for a low reflow temperature process. Journal of Surface Mount Technology, 36(3), 25-34. https://doi.org/10.37665/smt.v36i3.6
  
  Tarman, W., Alahmer, A., Bolanos, S., Pouya, S., Alakayleh, A., El Amine Belhadi, M., & Hamasha, S. (2024). Evaluating shear properties of individual solder joints in ball grid arrays: The impact of silver (Ag) and bismuth (Bi) content. In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1-8). IEEE Publishing. https://doi.org/10.1109/ITherm55375.2024.10709615
  
  Tian, R., Wang, C., Huang, Y., & Guo, X. (2022). Effects of nanoparticle addition on the reliability of Sn-based Pb-free solder joints under various conditions: A review. Nano, 18(01), Article 2330001. https://doi.org/10.1142/S1793292023300013
  
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  Zou, Y. S., Chung, M. H., Gan, C. L., Hsu, Y. T., & Takiar, H. (2021). Effects of Sb and Bi addition on IMC morphology and reliability of Pb-free solder/Cu-OSP. In 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (pp. 419-422). IEEE Publishing. https://doi.org/10.1109/EPTC53413.2021.9663897